Patent Assignment
Reel/Frame 031783/0134
Assignment of Assignor's Interest
Recorded: 2013-12-13
Pages: 3
Assignors
CHEN, KIM HONG
Executed: 2013-12-04
HUNG, WENSEN
Executed: 2013-12-04
HUANG, SZU-PO
Executed: 2013-12-09
JENG, SHIN-PUU
Executed: 2013-12-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same