Patent Assignment
Reel/Frame 031787/0259
Assignment of Assignor's Interest
Recorded: 2013-12-16
Pages: 3
Assignors
CHENG, CHUN-WEN
Executed: 2013-12-10
PENG, JUNG-HUEI
Executed: 2013-12-10
TSAI, SHANG-YING
Executed: 2013-12-10
TSAI, HUNG-CHIA
Executed: 2013-12-10
TENG, YI-CHUAN
Executed: 2013-12-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device with Through Molding Vias