Patent Assignment
Reel/Frame 031787/0609
Assignment of Assignor's Interest
Recorded: 2013-11-26
Pages: 5
Assignors
KWAK, BYOUNG-SOO
Executed: 2013-11-08
JO, CHA-JEA
Executed: 2013-11-08
CHO, TAE-JE
Executed: 2013-11-12
HAN, SANG-UK
Executed: 2013-11-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Semiconductor Multi-Chip Stack Packages