Patent Assignment
Reel/Frame 031818/0941
Assignment of Assignor's Interest
Recorded: 2013-12-19
Pages: 5
Assignors
WU, CHIEH-HAN
Executed: 2013-12-04
LEE, CHUNG-JU
Executed: 2013-12-04
TSAI, CHENG-HSIUNG
Executed: 2013-12-04
SHIEH, MING-FENG
Executed: 2013-12-06
LIU, RU-GUN
Executed: 2013-12-11
BAO, TIEN-I
Executed: 2013-12-04
SHUE, SHAU-LIN
Executed: 2013-12-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method for Integrated Circuit Patterning