Patent Assignment
Reel/Frame 031822/0278
Assignment of Assignor's Interest
Recorded: 2013-12-19
Pages: 2
Assignor
TERASAKI, MASATO
Executed: 2013-12-04
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Method and Substrate Processing Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.