Patent Assignment
Reel/Frame 031825/0434
Assignment of Assignor's Interest
Recorded: 2013-12-20
Pages: 3
Assignors
CHENG, CHUN-WEN
Executed: 2013-12-10
TSAI, HUNG-CHIA
Executed: 2013-12-10
CHAO, LAN-LIN
Executed: 2013-12-10
HSIEH, YUAN-CHIH
Executed: 2013-12-13
LIU, PING-YIN
Executed: 2013-12-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Micro Electromechanical System Sensor and Method of Forming the Same