IP Library Assignment 031829/0104
Patent Assignment
Reel/Frame 031829/0104

Assignment of Assignor's Interest

Recorded: 2013-12-20 Pages: 5
Assignors
TERASAKI, TADASHI
Executed: 2013-10-09
NAKAYAMA, MASANORI
Executed: 2013-10-15
TAKESHITA, MITSUNORI
Executed: 2013-10-10
FUNAKI, KATSUNORI
Executed: 2013-10-09
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Patent: 9,059,229 →
Application: 14/024,249 →
Publication: US 2014/0106573
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →