Patent Assignment
Reel/Frame 031832/0865
Assignment of Assignor's Interest
Recorded: 2013-12-20
Pages: 4
Assignors
TSENG, CHUNG-CHUAN
Executed: 2013-11-01
LIU, CHIA-WEI
Executed: 2013-11-01
CHU, LI-HSIN
Executed: 2013-11-01
TSAI, YU-HSIANG
Executed: 2013-11-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO. 8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Mechanisms for Forming Backside Illuminated Image Sensor Device Structure