Patent Assignment
Reel/Frame 031833/0403
Assignment of Assignor's Interest
Recorded: 2013-12-20
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TSMC)
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Backside Redistribution Layer (RDL) Structure