Patent Assignment
Reel/Frame 031834/0905
Assignment of Assignor's Interest
Recorded: 2013-12-20
Pages: 5
Assignors
AHN, YOUNG GHYU
Executed: 2013-11-29
LEE, SOON JU
Executed: 2013-11-29
PARK, HEUNG KIL
Executed: 2013-11-29
PARK, SANG SOO
Executed: 2013-11-29
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Chip Component and Board Having the Same Mounted Thereon