IP Library › Assignment 031840/0569
Patent Assignment
Reel/Frame 031840/0569

Assignment of Assignor's Interest

Recorded: 2013-12-23 Pages: 6
Assignors
TAN, JUAN BOON
Executed: 2013-12-11
LIU, WEI
Executed: 2013-12-11
TEE, KHENG CHOK
Executed: 2013-12-12
LEONG, KAM CHEW
Executed: 2013-12-12
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Three-Dimensional Integrated Circuit Structures Providing Thermoelectric Cooling and Methods for Cooling Such Integrated Circuit Structures
Patent: 9,847,272 →
Application: 14/138,593 →
Publication: US 2015/0179543
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →