Patent Assignment
Reel/Frame 031842/0693
Assignment of Assignor's Interest
Recorded: 2013-12-23
Pages: 6
Assignors
JANG, JONG MIN
Executed: 2013-12-20
KIM, HWA MOK
Executed: 2013-12-20
LEE, KYU HO
Executed: 2013-12-20
KIM, CHANG HOON
Executed: 2013-12-20
SUH, DAEWOONG
Executed: 2013-12-20
IN, CHI HYUN
Executed: 2013-12-20
PARK, DAE SEOK
Executed: 2013-12-20
CHAE, JONG HYEON
Executed: 2013-12-20
Assignee
SEOUL VIOSYS CO., LTD.
1B-36, 727-5 WONSI-DONG, DANWON-GU, GYEONGGI-DO, ANSAN-SI, 425-851, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Separating Substrate and Method of Fabricating Semiconductor Device Using the Same