Method of separating substrate and method of fabricating semiconductor device using the same
A method of fabricating a semiconductor device, the method including: forming a first mask pattern including a masking region and an open region on a substrate; forming a sacrificial layer to cover the substrate and the first mask pattern; patterning the sacrificial layer to form a seed layer and to expose the first mask pattern; forming a second mask pattern on the exposed first mask pattern; forming an epitaxial layer on the seed layer and the second mask pattern, and forming a void between the second mask pattern and the epitaxial layer; and separating the substrate from the epitaxial layer.
1. A method of separating a substrate, comprising:
forming a first mask pattern comprising a masking region and an open region, on a substrate;
forming a sacrificial layer covering the substrate and the first mask pattern;
patterning the sacrificial layer to form a seed layer and to expose at least a portion of the first mask pattern;
forming a second mask pattern on the exposed portion of the first mask pattern;
forming an epitaxial layer on the seed layer and the second mask pattern, and forming a void between the second mask pattern and the epitaxial layer; and
separating the substrate and the epitaxial layer.
2. The method of claim 1 , wherein the seed layer is formed on a portion of the masking region.
3. The method of claim 2 , wherein the seed layer is thicker than the second mask pattern.
4. The method of claim 2 , wherein the epitaxial layer is grown using the seed layer as a seed.
5. The method of claim 2 , wherein a width of the seed layer is smaller than a width of the masking region of the first mask pattern.
6. The method of claim 1 , further comprising forming a separation layer while patterning the sacrificial layer to form the seed layer,
wherein the separation layer is formed within the open region.
7. The method of claim 6 , wherein the second mask pattern covers the separation layer.
8. The method of claim 1 , wherein the separating the substrate comprises chemically etching the first and second mask patterns.
9. The method of claim 1 , wherein the separating the substrate comprises applying stress between the substrate and the epitaxial layer.
10. The method of claim 1 , wherein the patterning the sacrificial layer to form the seed layer comprises:
forming an etching mask pattern on the sacrificial layer; and
etching the sacrificial layer using the etching mask pattern as an etching mask,
wherein the second mask pattern is formed by a lift-off process using the etching mask pattern.
11. A method of fabricating a semiconductor device, comprising:
forming a first mask pattern comprising a masking region and an open region, on a substrate;
forming a sacrificial layer covering the substrate and the first mask pattern;
patterning the sacrificial layer to form a seed layer and to expose at least a portion of the first mask pattern;
forming a second mask pattern on the exposed portion of the first mask pattern;
forming an epitaxial layer on the seed layer and the second mask pattern, and forming a void between the second mask pattern and the epitaxial layer;
forming a support substrate on the epitaxial layer; and
separating the substrate from the epitaxial layer.
12. The method of claim 11 , wherein the seed layer is formed on a portion of the masking region.
13. The method of claim 12 , further comprising forming a separation layer within the open region, while patterning the sacrificial layer to form the seed layer.
14. The method of claim 12 , wherein the seed layer is thicker than the second mask pattern.
15. The method of claim 12 , wherein the epitaxial layer is grown using the seed layer as a seed.
16. The method of claim 15 , wherein the epitaxial layer comprises a first nitride semiconductor layer, an active layer, and a second nitride semiconductor layer.
17. The method of claim 16 , wherein the sacrificial layer comprises u-GaN or n-GaN.
18. The method of claim 11 , wherein the separating the substrate comprises chemically etching the first and second mask patterns.
19. The method of claim 11 , wherein the separating the substrate comprises applying stress between the substrate and the epitaxial layer.
20. The method of claim 11 , further comprising forming a dividing groove by patterning the epitaxial layer before forming the support substrate,
wherein the epitaxial layer is divided into semiconductor device regions by the dividing groove.
21. The method of claim 20 , further comprising forming at least one device region dividing groove by patterning the respective semiconductor device regions, after separating the substrate,
wherein the semiconductor device region is divided into device regions by the device region dividing groove.
22. The method of claim 11 , further comprising forming a device region dividing groove by patterning the epitaxial layer, after separating the substrate,
wherein the epitaxial layer is divided into device regions by the device region dividing groove.
23. The method of claim 21 , further comprising forming light emitting diode chips by dividing the support substrate at the device region dividing groove.