Assignment of Assignor's Interest

Recorded: 2013-12-23 Pages: 3

Assignor

GAO, CHUNYU

Executed: 2013-12-17

Assignee

HUAWEI DEVICE CO., LTD.

BUILDING B2, HUAWEI INDUSTRIAL BASE, BANTIAN, LONGGANG DISTRICT,, SHENZHEN, 518129, GUANGDONG, P.R., CHINA

Covered Property (1)

Method for Manufacturing Circuit Board, Circuit Board, and Electronic Device

Patent: 9,426,935 →

Application: 14/139,253 →

Publication: US 2014/0111949

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.