Method for manufacturing circuit board, circuit board, and electronic device
View Patent ↗Embodiments of the present invention disclose a method for manufacturing a circuit board, and a circuit board. The method includes: separately fixing at least two function modules and a shielding frame on a circuit board, where the shielding frame is located between the at least two function modules; packaging the at least two function modules and the shielding frame by using a plastic package material; cutting the plastic package material corresponding to the top of the shielding frame to a surface of the shielding frame; and covering an outside of the plastic package material and an top part of the shielding frame with a conducting material, and covering a surface of the conducting material with an insulation material. In the embodiments, the cutting height is decreased, the processing time is short, and good manufacturability is provided.
1. A method for manufacturing a circuit board, the method comprising:
separately attaching at least two function modules and a shielding frame on a substrate of a circuit board, wherein the shielding frame is located between the at least two function modules and does not overlie either of the at least two function modules;
packaging the at least two function modules and the shielding frame by using a plastic package material, so as to coat the at least two function modules and the shielding frame;
removing a portion of the plastic package material corresponding to a width of the shielding frame, the portion extending from a top surface of the package material to a top surface of the shielding frame; and
covering an outer surface of the plastic package material that is not removed and the top surface of the shielding frame with a conducting material, and covering an outer surface of the conducting material with an insulation material.
2. The method according to claim 1 , wherein a material of the shielding frame comprises iron.
3. The method according to claim 1 , wherein the conducting material comprises copper.
4. The method according to claim 2 , wherein the conducting material comprises copper.
5. The method according to claim 1 , wherein removing the portion of the plastic package material corresponding to the width of the shielding frame comprises: performing laser cutting on the plastic package material.
6. The method according to claim 1 , wherein the shielding frame and each of the at least two function modules has a respective height, wherein the height of the shielding frame is greater than a height of either of the at least two function modules.
7. The circuit board according to claim 1 , wherein the shielding frame and each of the at least two function modules has a respective height, wherein the height of the shielding frame is greater than a height of either of the at least two function modules.
8. The electronic device according to claim 1 , wherein the shielding frame and each of the at least two function modules has a respective height, wherein the height of the shielding frame is greater than a height of either of the at least two function modules.
9. A circuit board comprising:
a substrate;
at least two function modules;
a shielding frame, wherein the at least two function modules and the shielding frame are attached to the substrate, the shielding frame is located between the at least two function modules, and the shielding frame does not overlie either of the at least two function modules;
wherein two sides of the shielding frame and the at least two function modules are coated with a plastic package material;
wherein a top surface of the shielding frame and an outer surface of the plastic package material are covered with a conducting material; and
wherein an outer surface of the conducting material is covered with an insulation material.
10. The circuit board according to claim 9 , wherein a material of the shielding frame comprises iron.
11. The circuit board according to claim 9 , wherein the conducting material comprises copper.
12. The circuit board according to claim 10 , wherein the conducting material comprises copper.
13. An electronic device, comprising:
a circuit board comprising,
a substrate;
at least two function modules;
a shielding frame, wherein the at least two function modules and the shielding frame are attached to the substrate, the shielding frame is located between the at least two function modules, and the shielding frame does not overlie either of the at least two function modules;
wherein two sides of the shielding frame and the at least two function modules are coated with a plastic package material;
wherein a top surface of the shielding frame and an outer surface of the plastic package material are covered with a conducting material; and
wherein an outer surface of the conducting material is covered with an insulation material.
14. The electronic device according to claim 13 , comprising a mobile phone, a data card, a tablet computer, or a microprocessor.