Patent Assignment
Reel/Frame 031843/0043
Assignment of Assignor's Interest
Recorded: 2013-12-23
Pages: 5
Assignors
KIM, JONG HOON
Executed: 2013-12-06
SON, JAE HYUN
Executed: 2013-12-06
LEE, BYOUNG DO
Executed: 2013-12-06
CHUN, KUK JIN
Executed: 2013-11-13
CHOI, WOONG KYU
Executed: 2013-11-13
Assignees
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
SNU R&DB FOUNDATION
1, GWANAK-RO, GWANAK-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Stacked Type Semiconductor Package Having the Same