Patent Assignment
Reel/Frame 031846/0001
Assignment of Assignor's Interest
Recorded: 2013-12-24
Pages: 4
Assignors
HO, KUAN-LIN
Executed: 2013-12-12
CHEN, CHIN-LIANG
Executed: 2013-12-12
LIN, WEI-TING
Executed: 2013-12-12
LIU, YU-CHIH
Executed: 2013-12-12
LIN, SHIH-YEN
Executed: 2013-12-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Packaging Structure and Process