Patent Assignment
Reel/Frame 031853/0263
Assignment of Assignor's Interest
Recorded: 2013-12-27
Pages: 9
Assignors
SHIMAMURA, MASATO
Executed: 2013-12-06
OHNISHI, TSUKASA
Executed: 2013-12-09
KOSAI, MITSUHIRO
Executed: 2013-10-31
TAKAGI, KAZUYORI
Executed: 2013-10-31
NONAKA, TOMOKO
Executed: 2013-10-31
SUZUKI, MASAYUKI
Executed: 2013-12-06
HAYASHIDA, TORU
Executed: 2013-10-31
ISHIBASHI, SEIKO
Executed: 2013-11-24
YOSHIKAWA, SHUNSAKU
Executed: 2013-11-27
YAMANAKA, YOSHIE
Executed: 2013-11-27
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Lead-Free Solder Alloy