Patent Assignment
Reel/Frame 031854/0145
Assignment of Assignor's Interest
Recorded: 2013-12-27
Pages: 4
Assignors
ANTOKU, YUKI
Executed: 2013-12-20
YASUHARA, KAZUHIKO
Executed: 2013-12-20
CHIBA, JUN
Executed: 2013-12-20
CHEN, WEI
Executed: 2013-12-20
OKAZAKI, JUNICHI
Executed: 2013-12-20
MAEDA, NANAKO
Executed: 2013-12-20
Assignee
TANAKA DENSHI KOGYO K.K.
7-3, MARUNOUCHI 2-CHOME,, TOKYO BUILDING 22F,, CHIYODA-KU, TOKYO, 100-6422, JAPAN
Covered Property
(1)
Bonding Wire for High-Speed Signal Line