Patent Assignment
Reel/Frame 031859/0796
Assignment of Assignor's Interest
Recorded: 2013-12-30
Pages: 6
Assignors
KAO, MIN-FENG
Executed: 2013-12-17
YAUNG, DUN-NIAN
Executed: 2013-12-17
LIU, JEN-CHENG
Executed: 2013-12-17
CHUANG, CHUN-CHIEH
Executed: 2013-12-17
HUNG, FENG-CHI
Executed: 2013-12-17
TSAI, SHUANG-JI
Executed: 2013-12-17
LIN, JENG-SHYAN
Executed: 2013-12-17
TSAI, SHU-TING
Executed: 2013-12-17
HSU, WEN-I
Executed: 2013-12-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structure and Method for 3D Image Sensor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.