Patent Assignment
Reel/Frame 031860/0771
Assignment of Assignor's Interest
Recorded: 2013-12-30
Pages: 5
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Ceramic Electronic Component to Be Embedded in Board, Manufacturing Method Thereof, and Printed Circuit Board Having Multilayer Ceramic Electronic Component Embedded Therein