Patent Assignment
Reel/Frame 031861/0553
Assignment of Assignor's Interest
Recorded: 2013-12-31
Pages: 3
Assignors
HUNG, WENSEN
Executed: 2013-12-18
HUANG, SZU-PO
Executed: 2013-12-18
CHEN, KIM HONG
Executed: 2013-12-18
JENG, SHIN-PUU
Executed: 2013-12-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3DIC Packages with Heat Sinks Attached to Heat Dissipating Rings