Patent Assignment
Reel/Frame 031880/0113
Assignment of Assignor's Interest
Recorded: 2014-01-02
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Method and Substrate Processing Apparatus