Patent Assignment
Reel/Frame 031892/0343
Assignment of Assignor's Interest
Recorded: 2014-01-06
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2013-12-25
LIU, CHUNG-SHI
Executed: 2013-12-25
KUO, HUNG-JUI
Executed: 2013-12-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Staggered Via Redistribution Layer (RDL) for a Package and a Method for Forming the Same