Patent Assignment
Reel/Frame 031893/0290
Assignment of Assignor's Interest
Recorded: 2014-01-06
Pages: 7
Assignors
LEE, CHUNGSUN
Executed: 2013-11-25
AHN, JUNG-SEOK
Executed: 2013-11-27
CHOI, KWANG-CHUL
Executed: 2013-11-23
KANG, UN-BYOUNG
Executed: 2013-11-28
KIM, JUNG-HWAN
Executed: 2013-11-27
SOHN, JOONSIK
Executed: 2013-11-27
LEE, JEON-IL
Executed: 2013-11-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Methods for Processing Substrates