Patent Assignment
Reel/Frame 031917/0966
Assignment of Assignor's Interest
Recorded: 2014-01-08
Pages: 4
Assignor
LEE, HEE KWON
Executed: 2013-03-08
Assignee
SAMSUNG DISPLAY CO., LTD.
95, SAMSUNG 2 RO, GIHEUNG-GU, YONGIN-CITY, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-On-Film Package and Display Device Having the Same