Assignment of Assignor's Interest

Recorded: 2014-01-08 Pages: 6

Assignors

KIM, TAEK-SUNG

Executed: 2013-12-27

LEE, SANGBO

Executed: 2013-12-27

HUR, SOONYONG

Executed: 2013-12-29

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF

Covered Property (1)

Semiconductor Package Including Stacked Chips and Method of Fabricating the Same

Patent: 9,424,954 →

Application: 14/150,092 →

Publication: US 2014/0347943

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.