Patent Assignment
Reel/Frame 031921/0191
Assignment of Assignor's Interest
Recorded: 2014-01-08
Pages: 3
Assignor
TAKAHASHI, TETSUO
Executed: 2013-11-05
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof