Patent Assignment
Reel/Frame 031928/0131
Assignment of Assignor's Interest
Recorded: 2014-01-09
Pages: 5
Assignors
TANAKA, KOICHI
Executed: 2014-01-06
KURASHIMA, NOBUYUKI
Executed: 2014-01-06
IIZUKA, HAJIME
Executed: 2014-01-06
SHIRAKI, SATOSHI
Executed: 2014-01-06
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Built-In Electronic Component Substrate and Method for Manufacturing the Substrate