IP Library Assignment 031933/0709
Patent Assignment
Reel/Frame 031933/0709

Assignment of Assignor's Interest

Recorded: 2014-01-09 Pages: 3
Assignors
LIN, HUNG-WEN
Executed: 2013-12-16
KUO, TING-AN
Executed: 2013-12-16
LIAO, YU-JING
Executed: 2013-12-16
CHUANG, I-CHENG
Executed: 2013-12-16
Assignee
HTC CORPORATION
NO.23, XINGHUA RD., TAOYUAN CITY,, TAOYUAN COUNTY, 330, TAIWAN
Covered Property (1)
Electronic Module and Heat Dissipation Module
Patent: 9,867,312 →
Application: 14/108,348 →
Publication: US 2015/0173237