Patent Assignment
Reel/Frame 031934/0227
Assignment of Assignor's Interest
Recorded: 2014-01-10
Pages: 3
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Fan-Out Semiconductor Package with Copper Pillar Bumps