Patent Assignment
Reel/Frame 031934/0699
Assignment of Assignor's Interest
Recorded: 2014-01-10
Pages: 4
Assignors
LIU, NAI-WEI
Executed: 2010-06-07
WU, ZHEN-CHENG
Executed: 2010-06-07
HUANG, CHENG-LIN
Executed: 2010-06-07
HUANG, PO-HSIANG
Executed: 2010-06-07
WANG, YUNG-CHIH
Executed: 2010-06-07
SU, SHU-HUI
Executed: 2010-06-07
CHEN, DIAN-HAU
Executed: 2010-06-07
MII, YUH-JIER
Executed: 2010-06-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Making a Semiconductor Device Including Barrier Layers for Copper Interconnect