IP Library › Assignment 031938/0163
Patent Assignment
Reel/Frame 031938/0163

Assignment of Assignor's Interest

Recorded: 2014-01-10 Pages: 10
Assignors
CASES, MOISES
Executed: 2014-01-07
KIM, TAE HONG
Executed: 2014-01-08
MANDREKAR, ROHAN U.
Executed: 2014-01-08
SHERALI, NUSRAT I.
Executed: 2014-01-09
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Through-Hole-Vias in Multi-Layer Printed Circuit Boards
Patent: 9,277,653 →
Application: 14/152,096 →
Publication: US 2014/0123489
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0111 →
Assignment of Assignor's Interest May 6, 2016
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 038483/0940 →
Assignment of Assignor's Interest Sep 6, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO INTERNATIONAL LIMITED
Reel/Frame 050301/0033 →