Patent Assignment
Reel/Frame 031939/0139
Assignment of Assignor's Interest
Recorded: 2014-01-10
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-01-05
LIU, CHUNG-SHI
Executed: 2014-01-02
HUANG, CHIH-FAN
Executed: 2014-01-02
TSAI, TSAI-TSUNG
Executed: 2014-01-02
LIN, WEI-HUNG
Executed: 2014-01-02
CHENG, MING-DA
Executed: 2014-01-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN ROAD, VI, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package, Semiconductor Device and Method of Forming the Same