Patent Assignment
Reel/Frame 031950/0124
Assignment of Assignor's Interest
Recorded: 2014-01-13
Pages: 6
Assignors
CHOI, IN-HO
Executed: 2013-12-23
KIM, YONG-HOON
Executed: 2013-12-23
SHIN, SEONG-HO
Executed: 2013-12-23
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Emi Shielding Function and Heat Dissipation Function