IP Library Assignment 031958/0047
Patent Assignment
Reel/Frame 031958/0047

Assignment of Assignor's Interest

Recorded: 2014-01-14 Pages: 6
Assignor
REUSCH, THILO
Executed: 2014-01-08
Assignee
OSRAM OPTO SEMICONDUCTORS GMBH
LEIBNIZSTR. 4, REGENSBURG, 93055, GERMANY
Covered Property (1)
Encapsulation Structure for an Optoelectronic Component and Method for Encapsulating an Optoelectronic Component
Patent: 9,412,971 →
Application: 14/232,632 →
Publication: US 2014/0210112
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Spin-Off of the Original Assignee Dec 11, 2014
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 034679/0212 →
Merger Feb 17, 2026
From: OSRAM OLED GMBH
To: AMS-OSRAM INTERNATIONAL GMBH
Reel/Frame 074881/0104 →