Encapsulation structure for an optoelectronic component and method for encapsulating an optoelectronic component
View Patent ↗An encapsulation structure for an optoelectronic component may include: a barrier thin-film layer for protecting an optoelectronic component against chemical impurities; a cover layer applied above the barrier thin-film layer and serving for protecting the barrier thin-film layer against mechanical damage; and an intermediate layer applied on the barrier thin-film layer between barrier thin-film layer and cover layer and including a curable material designed such that when the non-cured intermediate layer is applied to the barrier thin-film layer, particle impurities at the surface of the barrier thin-film layer are enclosed by the intermediate layer and the applied intermediate layer has a substantially planar surface, and that after the intermediate layer has been cured, mechanical loads on the barrier thin-film layer as a result of particle impurities during the application of the cover layer are reduced by the intermediate layer.
1. An encapsulation structure for an optoelectronic component, comprising:
a barrier thin-film layer for protecting an optoelectronic component against chemical impurities;
a cover layer applied above the barrier thin-film layer and serving for protecting the barrier thin-film layer against mechanical damage; and
an intermediate layer applied on the barrier thin-film layer between barrier thin-film layer and cover layer and comprising a curable material designed such that when the non-cured intermediate layer is applied to the barrier thin-film layer, particle impurities at the surface of the barrier thin-film layer are enclosed by the intermediate layer and the applied intermediate layer has a substantially planar surface, and that after the intermediate layer has been cured, mechanical loads on the barrier thin-film layer as a result of particle impurities during the application of the cover layer are reduced by the intermediate layer.
2. The encapsulation structure as claimed in claim 1 ,
wherein the curable material of the intermediate layer is formed as self-curing material, as thermally curing material, as UV-curing or as radiation-curing material.
3. The encapsulation structure as claimed in claim 1 ,
wherein the curable material of the intermediate layer is formed as flexible curable material and/or as transparent curable material and/or as UV-resistant curable material.
4. The encapsulation structure as claimed in claim 1 ,
wherein the curable material of the intermediate layer is a lacquer material.
5. The encapsulation structure as claimed in claim 1 ,
wherein the curable material of the intermediate layer includes one or more of the following materials: a plastic, an epoxide, an acrylate, an imide, a carbonate, an olefin, a styrene, a urethane, a derivative of at least one of the materials in the form of monomers, oligomers or polymers, a mixture comprising at least two of the materials, or a copolymer or a compound comprising at least one of the materials.
6. The encapsulation structure as claimed in claim 1 ,
wherein the hardness of the intermediate layer is more than 70.
7. The encapsulation structure as claimed in claim 1 ,
wherein the layer thickness of the intermediate layer is approximately 100 nm to approximately 100 μm.
8. The encapsulation structure as claimed in claim 1 ,
wherein the cover layer is laminated on the intermediate layer.
9. An encapsulation arrangement, comprising:
an optoelectronic component having at least one functional layer;
an encapsulation structure formed above the at least one functional layer, the encapsulation structure, comprising:
a barrier thin-film layer for protecting an optoelectronic component against chemical impurities;
a cover layer applied above the barrier thin-film layer and serving for protecting the barrier thin-film layer against mechanical damage; and
an intermediate layer applied on the barrier thin-film layer between barrier thin-film layer and cover layer and comprising a curable material designed such that when the non-cured intermediate layer is applied to the barrier thin-film layer, particle impurities at the surface of the barrier thin-film layer are enclosed by the intermediate layer and the applied intermediate layer has a substantially planar surface, and that after the intermediate layer has been cured, mechanical loads on the barrier thin-film layer as a result of particle impurities during the application of the cover layer are reduced by the intermediate layer.
10. The encapsulation arrangement as claimed in claim 9 ,
wherein the at least one functional layer is formed as an organic functional layer.
11. A method for encapsulating an optoelectronic component, the method comprising:
applying a barrier thin-film layer on or above an optoelectronic component for protecting the optoelectronic component against chemical impurities;
applying an intermediate layer on the barrier thin-film layer, wherein the intermediate layer comprises a curable material designed such that when the non-cured intermediate layer is applied to the barrier thin-film layer, particle impurities at the surface of the barrier thin-film layer are enclosed by the intermediate layer and the applied intermediate layer has a substantially planar surface;
curing the intermediate layer; and
applying a cover layer above the cured intermediate layer for protecting the barrier thin-film layer against mechanical damage,
wherein the curable material of the intermediate layer is designed such that after the intermediate layer has been cured, said intermediate layer has a hardness such that mechanical loads on the barrier thin-film layer that are caused as a result of particle impurities during the application of the cover layer are reduced by means of the intermediate layer.
12. The method as claimed in claim 11 ,
wherein the intermediate layer is cured by means of a thermal treatment, by means of UV radiation, by means of radiation or without external action.
13. The method as claimed in claim 11 ,
wherein the curable material of the intermediate layer comprises a lacquer material.
14. The method as claimed in claim 11 ,
wherein the curable material of the intermediate layer comprises one or more of the following materials: a plastic, an epoxide, an acrylate, an imide, a carbonate, an olefin, a styrene, a urethan, a derivative of at least one of the materials in the form of monomers, oligomers or polymers, a mixture comprising at least two of the materials, or a copolymer or a compound comprising at least one of the materials.
15. The method as claimed in claim 11 ,
wherein the intermediate layer is applied by means of a contactless application method.
16. The method as claimed in claim 15 ,
wherein the contactless application method comprises at least one of the following methods:
a spraying method;
a spin coating method;
a dip coating method;
a slot die coating method;
a doctor blading method.
17. The method as claimed in claim 11 ,
wherein applying the cover layer comprises laminating the cover layer onto the intermediate layer.