Patent Assignment
Reel/Frame 031963/0161
Assignment of Assignor's Interest
Recorded: 2014-01-14
Pages: 2
Assignors
KUNDU, AMIT
Executed: 2014-01-08
HORNG, JAW-JUINN
Executed: 2014-01-08
CHEN, CHUNG-HUI
Executed: 2014-01-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD, HSINCHU SCIENCE PARK,, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device with Self-Heat Reducing Layers