Patent Assignment
Reel/Frame 031964/0646
Assignment of Assignor's Interest
Recorded: 2014-01-14
Pages: 5
Assignors
CHA, JI BUM
Executed: 2013-12-30
LEE, SUNG JAE
Executed: 2013-12-30
CHANG, IN CHEOL
Executed: 2013-12-30
BYUN, SUNG JUN
Executed: 2013-12-30
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Image Sensor Module and Method of Manufacturing the Same