Patent Assignment
Reel/Frame 031965/0331
Assignment of Assignor's Interest
Recorded: 2014-01-14
Pages: 4
Assignors
TSAI, SHU-TING
Executed: 2013-11-27
YAUNG, DUN-NIAN
Executed: 2013-12-05
LIU, JEN-CHENG
Executed: 2013-11-27
CHUANG, CHUN-CHIEH
Executed: 2013-11-27
LIN, CHIA-CHIEH
Executed: 2013-11-27
CHEN, U-TING
Executed: 2013-11-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3DIC Interconnect Apparatus and Method