IP Library › Assignment 031968/0516
Patent Assignment
Reel/Frame 031968/0516

Assignment of Assignor's Interest

Recorded: 2014-01-14 Pages: 7
Assignors
LIU, HAO
Executed: 2008-07-17
SUN, YI SHENG ANTHONY
Executed: 2008-07-17
KOLAN, RAVI KANTH
Executed: 2008-07-17
TOH, CHIN HOCK
Executed: 2008-07-17
Assignee
UNITED TEST AND ASSEMBLY CENTER LTD.
5 SERANGOON NORTH AVENUE 5, SINGAPORE, 554916, SINGAPORE
Covered Property (1)
Through Silicon via Dies and Packages
Patent: 8,741,762 →
Application: 14/058,310 →
Publication: US 2014/0045301
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment. Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment. Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →