Patent Assignment
Reel/Frame 031974/0800
Assignment of Assignor's Interest
Recorded: 2014-01-15
Pages: 7
Assignors
SAMADI, KAMBIZ
Executed: 2014-01-02
PANTH, SHREEPAD AMAR
Executed: 2014-01-08
KAMAL, PRATYUSH
Executed: 2014-01-07
DU, YANG
Executed: 2014-01-06
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) USING CLUSTERING TO INCREASE USABLE WHITESPACE