Patent Assignment
Reel/Frame 031987/0288
Assignment of Assignor's Interest
Recorded: 2014-01-16
Pages: 3
Assignors
YU, CHEN-HUA
Executed: 2014-01-10
JENG, SHIN-PUU
Executed: 2014-01-09
YEH, DER-CHYANG
Executed: 2014-01-10
CHEN, HSIEN-WEI
Executed: 2014-01-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Pad Structure Design in Fan-Out Package