Patent Assignment
Reel/Frame 031993/0097
Assignment of Assignor's Interest
Recorded: 2014-01-17
Pages: 2
Assignor
WU, JIUN YI
Executed: 2014-01-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package-On-Package with via on Pad Connections