Patent Assignment
Reel/Frame 031995/0823
Assignment of Assignor's Interest
Recorded: 2014-01-17
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2013-12-19
YEH, DER-CHYANG
Executed: 2013-12-19
YEE, KUO-CHUNG
Executed: 2013-12-19
HUNG, JUI-PIN
Executed: 2013-12-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Chip on Package Structure and Method