Patent Assignment
Reel/Frame 031996/0561
Assignment of Assignor's Interest
Recorded: 2014-01-17
Pages: 4
Assignors
CHI, CHIH-CHIEN
Executed: 2014-01-07
TUNG, SZU-PING
Executed: 2014-01-07
HUANG, HUNG-YI
Executed: 2014-01-07
HSIEH, CHING-HUA
Executed: 2014-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8 LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Metal Capping Process And Processing Platform Thereof