Patent Assignment
Reel/Frame 032003/0109
Assignment of Assignor's Interest
Recorded: 2014-01-20
Pages: 4
Assignors
DO, BYUNG TAI
Executed: 2014-01-15
TRASPORTO, ARNEL SENOSA
Executed: 2014-01-15
KIM, SUNG SOO
Executed: 2014-01-15
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Fiber-Less Substrate and Method of Manufacture Thereof
Patent:
9,147,662 →
Application:
14/137,755 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.