Patent Assignment
Reel/Frame 032010/0941
Assignment of Assignor's Interest
Recorded: 2014-01-21
Pages: 7
Assignors
CHOI, EUN-KYOUNG
Executed: 2013-12-27
KIM, JONG-YOUN
Executed: 2014-01-02
PARK, SANG-WOOK
Executed: 2013-12-31
YU, HAE-JUNG
Executed: 2013-12-31
LEE, IN-YOUNG
Executed: 2013-12-30
HAN, SANG-UK
Executed: 2013-12-27
HONG, JI-SEOK
Executed: 2013-12-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Including a Heat Spreader and Methods of Forming the Same