Patent Assignment
Reel/Frame 032017/0792
Assignment of Assignor's Interest
Recorded: 2014-01-22
Pages: 4
Assignors
LEI, WEI-SHENG
Executed: 2014-01-20
SINGH, SARAVJEET
Executed: 2014-01-22
DINEV, JIVKO
Executed: 2014-01-20
IYER, APARNA
Executed: 2014-01-21
EATON, BRAD
Executed: 2014-01-21
KUMAR, AJAY
Executed: 2014-01-21
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Wafer Dicing with Etch Chamber Shield Ring for Film Frame Wafer Applications