Patent Assignment
Reel/Frame 032018/0176
Assignment of Assignor's Interest
Recorded: 2014-01-22
Pages: 11
Assignors
KERNESS, NICOLE D.
Executed: 2013-12-23
JONES, JOY T.
Executed: 2013-12-05
EDWARDS, CHRISTOPHER F.
Executed: 2013-12-06
SAMOILOV, ARKADII V.
Executed: 2013-12-06
BENZEL, PHILLIP J.
Executed: 2013-12-06
OLSEN, RICHARD I.
Executed: 2013-12-31
HARPER, PETER R.
Executed: 2014-01-02
Assignee
MAXIM INTEGRATED PRODUCTS, INC.
160 RIO ROBLES, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multichip Wafer Level Package (Wlp) Optical Device